Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!
—— Peter Goolsby
Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej
—— Antonello Sau
Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!
—— Chris Rogers
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40 shore a heat absorbing material produkcja online
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Czytaj więcej
-40 to 160℃ low cost insulation silicone pad for LED Ceilinglamp,20 Shore 00 The TIF180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature ... Czytaj więcej
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Czytaj więcej
Thermal conductive gap pad for semiconductor automated test equipment (ATE),20±5 Shore 00,3.0 W/m-K The TIF1120-30-11US is recommended for applications that require a minimum amount of pressure on components. ... Czytaj więcej
4.5mmT,20±5 Shore 00 Good performance thermal conductive pad for Automotive engine control units, The TIF1180-30-11US is recommended for applications that require a minimum amount of pressure on components. The ... Czytaj więcej
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Czytaj więcej
soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on ... Czytaj więcej
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The ... Czytaj więcej
Two Component Thermally Conductive Wave Absorbing Gel For Battery Management System In New Energy Vehicles Company Profile Dongguan Ziitek Electronic Material and Technology Co., Ltd. is a professional ... Czytaj więcej
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Czytaj więcej