Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!
—— Peter Goolsby
Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej
—— Antonello Sau
Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!
Silicone Thermal Gap Filler 8.0W 2.0mmT The TIF780QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low... Czytaj więcej
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Czytaj więcej
Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB The TIFTM300 Series is recommended for applications that require a minimum amount of pressure on components. The ... Czytaj więcej
LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU The TIF7100RUS is recommended for applications that require a minimum amount of pressure on components. ... Czytaj więcej
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Czytaj więcej
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Czytaj więcej
High-Density conductive thermal pad For CPU The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low... Czytaj więcej
Silicone Thermal Gap Filler Used In Chassis Or Other Heat Dissipation Components The TIF®100-06U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ... Czytaj więcej
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Czytaj więcej
Viscoelastic Thermal Gap Pad, 3.0mmT, 2.5g/Cc, 18 Shore 00 For LED Power Supply UL Recognized 1.5mmT Thermal Gap Pad, 2.5g/cc, 18 Shore 00 for Audio Video Components The TIF1120-18-01US is recommended for ... Czytaj więcej