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Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions

Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions
Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions
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Szczegóły Produktu:
Place of Origin: China
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Model Number: TS-TIF100C 6530-11
Zapłata:
Minimum Order Quantity: 1000pcs
Cena: Negocjowalne
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Szczegółowy opis produktu
Nazwa produktu: Elastyczna podkładka do wypełniania luk cieplnych do rozwiązań baterii i zlewek cieplnych Keywords: Thermal Gap Filler
Hardness: 30 Shore 00 Kolor: szary
Thermal conductivity& Compostion: 6.5W/m-K Specific Gravity: 3.4g/cc
Thickness: 0.012"(0.30mm)~0.200"(5.00mm) Construction: Ceramic filled silicone elastomer
Continuos Use Temp: -45℃ to 200℃ Application: Battery And Heat Sink Solutions
Podkreślić:

Bateria podkładka termiczna wypełniająca luki

,

Płytka wypełniająca luki termiczne zlewu cieplnego

,

Elastyczna podkładka do wypełniania luk cieplnych

Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

 

TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 6.5W/mK

> Self-adhesive without the need for additional surface adhesive
> Naturally tacky needing no further adhesive coating
> UL recognized
> Easy release construction
> Electrically isolating
> High durability


Applications:

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Typical Properties of  TS-TIF®100C 6530-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 30 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.5W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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