logo
Dom ProduktyPodkładka termoprzewodząca

Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

Im Online Czat teraz

Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll

Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll

Duży Obraz :  Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll

Szczegóły Produktu:
Place of Origin: China
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Model Number: TIF760HQ Series
Zapłata:
Minimum Order Quantity: 1000pcs
Cena: Negocjowalne
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Szczegółowy opis produktu
Products name: Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll Hardness: 45±5 Shore 00
Keywords: Thermal Pad In Roll Thermal conductivity& Compostion: 8.0 W/m-K
Specific Gravity: 3.5g/cc Thickness: 1.5mmT
Color: Gray Continuos Use Temp: -45℃ to 200℃
Construction: Ceramic filled silicone elastomer

Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll

 

The TIF760HQ is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:


> Good thermal conductive:8.0W/MK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> Heat pipe thermal solutions
> Memory Modules
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
> Monitoring the Power Box

 

Typical Properties of TIF760QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.5g/cc ASTM D297
thickness 1.5mmT ASTM D374
Hardness (thickness<1.0mm) 55±5 (Shore 00) ASTM 2240
Hardness (thickness≥ 1.0mm) 45±5 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0MHz ASTM D150
Volume Resistivity 1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

Wyślij zapytanie bezpośrednio do nas (0 / 3000)

Inne produkty