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Szczegóły Produktu:
Zapłata:
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| Nazwa produktów: | Miękka podkładka silikonowa o grubości 1,5 mm do 5,0 mm 1,5 W o wysokiej przewodności cieplnej do pr | Słowa kluczowe: | Podkładka termiczna |
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| Przewodność cieplna: | 1,5 W/mK | Kolor: | Szary |
| Ciągła temp. użytkowania: | -45 do 200 ℃ | Próbka: | Próbka wolna |
| Grubość: | 0,020 "(0,5 mm) ~ 0,200" (5,0 mm) | Twardość: | 35 Brzeg 00 |
| Aplikacja: | Procesor GPU Półprzewodnikowe rozpraszanie ciepła |
1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad
The TIF®100-10E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIF®100-10E Series | |||
| Property | Value | Test method | |
| Color | Gray | ****** | |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** | |
| Thickness range | 0.020"(0.5mm)~0.200"(0.50mm) | ASTM D374 | |
| Specific Gravity | 2.3g/cc | ASTM D297 | |
| Hardness | 35 Shore 00 | ASTM 2240 | |
| Continuos Use Temp | -45 to 200℃ | ****** | |
| Dielectric Breakdown Voltage | > 5500 VAC | ASTM D149 | |
| Dielectric Constant | 4.7 MHz | ASTM D150 | |
| Volume Resistivity | 2.0 X1012 Ohm-meter | ASTM D257 | |
| Flame rating | 94 V0 | UL E331100 | |
| Outgassing(TML) | 0.35% | ASTM E595 | |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 | |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Osoba kontaktowa: Dana Dai
Tel: 18153789196
