logo
Dom ProduktyPodkładka termoprzewodząca

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

Im Online Czat teraz

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Duży Obraz :  Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF500-50-11US
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni
Możliwość Supply: 100000pcs/dzień
Szczegółowy opis produktu
Nazwa produktu: Termiczna podkładka silikonowa 5,0 W Arkusz rozpraszający ciepło o wysokiej przewodności dla serweró Kolor: Ciemnoszary
Aplikacja: Serwery AI, falowniki, urządzenia telekomunikacyjne Przewodność cieplna: 5,0 W/mK
Gęstość (g/cm3): 3.4 Stała dielektryczna @1MHz: 4.5
Twardość: 65 brzeg00 Słowa kluczowe: Podkładka silikonowa termicznie

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


The TIF®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.
 
Features:

>  Good thermal conductivity: 5.0W/mK

>  Ultra soft and highly compliant
>  Self-adhesive without the need for additional surface adhesives
>  Good insulation performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

 

Typical Properties of TIF®500-50-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.50)

0.030~0.200 (0.75~5.0) ASTM D374
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470

5.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.010"(0.25 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

Wyślij zapytanie bezpośrednio do nas (0 / 3000)

Inne produkty