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High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Duży Obraz :  High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF100-40-11U
Zapłata:
Minimalne zamówienie: 1000 szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni pracy
Zasady płatności: T/T
Możliwość Supply: 10000/dzień
Szczegółowy opis produktu
Nazwa produktu: Wysokowydajny wypełniacz szczelin termicznych na bazie silikonu do serwerów AI z procesorami AI Kontynuuj użycie Temp: -40 do 200 ℃
Napięcie przebicia dielektryka: >5500VAC Stała dielektryczna: 7,0 MHz
Kolor: Ciemnoszary Środek ciężkości: 3.2 g/cc
Słowa kluczowe: Wypełniacz szczelin termicznych Przewodność cieplna: 4.0W/mK
Aplikacja: Procesory AI Serwery AI

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

The TIF®100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:


> Good thermal conductive: 4.0W/mK 

> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®100-40-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
4.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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