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High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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High Performance 10.0W Thermal GAP PAD Materials For Al Servers

High Performance 10.0W Thermal GAP PAD Materials For Al Servers

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Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF700UU
Zapłata:
Minimalne zamówienie: 1000 szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni
Możliwość Supply: 100000 sztuk/dzień
Szczegółowy opis produktu
Nazwa produktu: Wysokowydajne materiały termoizolacyjne PAD o mocy 10,0 W do serwerów Al Słowa kluczowe: Materiały termoizolacyjne PAD
Kolor: Szary Przewodność cieplna: 10,0 W/mK
Twardość: 30 brzeg 00 Gęstość (g/cm3): 3.3
Stała dielektryczna @1MHz: 7.0 Aplikacja: Serwery AI, falowniki, urządzenia telekomunikacyjne

High Performance 10.0W Thermal GAP PAD Materials For Al Servers

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


The TIF®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.
 
Features:

>  Good thermal conductivity: 10.0W/mK

>  Super soft and highly compliant
>  Self-adhesive without the need for additional surface adhesives
>  Good insulation performance


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

 

Typical Properties of TIF®700UU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm)

0.030

(0.75)

0.040~0.200 (1.00~5.00) ASTM D374
Hardness 30/10 Shore 00 30/10 Shore 00 ASTM 2240
Recommended Operating Temperature -40 ~ 200℃ ******
Breakdown Voltage(V/mm) ≥4000 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 10.0 W/m-K ASTM D5470

10.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.030"(0.75 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

High Performance 10.0W Thermal GAP PAD Materials For Al Servers 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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