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Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Duży Obraz :  Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF100-50-11U
Zapłata:
Minimalne zamówienie: 1000 szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni roboczych
Zasady płatności: T/T
Możliwość Supply: 100000 sztuk/dzień
Szczegółowy opis produktu
Nazwa produktu: Ultramiękkie materiały termoizolacyjne na bazie silikonu do serwerów AI z procesorami AI Przewodność cieplna: 5,0 W/mK
Słowa kluczowe: Materiały termoizolacyjne PAD Ocena płomienia: UL 94 V-0
Aplikacja: Procesory AI Serwery AI Twardość: 27 Shore 00
Kontynuuj użycie Temp: -40 do 200 ℃ Środek ciężkości: 3,4 g/cm3
Budowa: Elastomer silikonowy z wypełnieniem ceramicznym

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Application:


Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of The TIF®100-50-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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