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Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Good Insulation Thermally Conductive  Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Duży Obraz :  Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF200-04ES
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni pracy
Zasady płatności: T/T
Możliwość Supply: 10000/dzień
Szczegółowy opis produktu
Nazwa produktu: Dobra izolacja Termoprzewodząca silikonowa podkładka termiczna 1,0 W / MK Odporna na ciepło podkładk Kolor: Różowy/niebieski
Aplikacja: 5G, przemysł lotniczy, sztuczna inteligencja, magazynowanie energii, przemysł, sprzęt oświetleniowy Grubość: 0,5 mm ~ 5,0 mm (0,020" ~ 0,200")
Przewodność cieplna: 1,0 W/mk Środek ciężkości: 1,75 g/cm3
Twardość: 7 brzeg00 Słowa kluczowe: Podkładka termiczna
Budowa i kompostowanie: Elastomer silikonowy z wypełnieniem ceramicznym

Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

 

 Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

The TIF®200-04ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices, new energy vehicles, and portable electronic devices.


Features

 

> Good thermal conductivity
> Extremely soft, low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Puncture-resistant, tear-resistant,and scratch-resistant performance

 

Applications

 

Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®200-04ES Series
Property Value Test method
Color Blue/ Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 1.75 ASTM D792
Thickness Range(inch/mm)

0.020~0.030/

(0.50~0.75)

0.040~0.200/

(1.00~5.00)

ASTM D374
Hardness 7 Shore 00 7 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥8000 ASTM D149
Dielectric Constant @1MHz 4.9 ASTM D150
Volume Resistivity >1.0X1013 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 1.0 ASTM D5470
1.0 ISO22007
∑D3-D10(Siloxane contentPPM) <100 GC-MS
Total mass loss(TML)(%) ND 130℃,24H
Flame rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
 
Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
 
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Good Insulation Thermally Conductive  Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Questions

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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