|
|
Szczegóły Produktu:
Zapłata:
|
| Nazwa produktów: | Ultra miękka podkładka termiczna 3,0 W Wysokowydajne silikonowe podkładki szczelinowe do podzespołów | Twardość: | 12 Brzeg 00 |
|---|---|---|---|
| Grubość: | 0,25 mm ~ 5,0 mmT | Budowa: | Elastomer silikonowy z wypełnieniem ceramicznym |
| Kolor: | Ciemnoszary | Przewodność cieplna i kompostion: | 3,0 W/mK |
| Kontynuuj użycie Temp: | -40 ℃ do 200 ℃ | Słowa kluczowe: | Ultra miękka podkładka termiczna |
| Środek ciężkości: | 3,15 g/cc | Aplikacja: | Części elektroniczne |
Ultra Soft Thermal Pad 3.0W High-Performance Silicone Gap Pads For Electronic Components
TIF®500-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.
Features:
> High thermal conductivity
> Extremely soft
> Low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications:
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®500-30-11ES Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.15 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 12 Shore 00 | 12 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL94 (E331100) | |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 | |
| 3.0 W/m-K | ISO22007 | ||
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Osoba kontaktowa: Dana Dai
Tel: 18153789196
