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RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

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RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Duży Obraz :  RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF500-65-11US
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni roboczych
Zasady płatności: T/T
Możliwość Supply: 100000 sztuk/dzień
Szczegółowy opis produktu
Nazwa produktów: Podkładki termiczne z certyfikatem RoHS 6,5 W/MK Silikonowa podkładka chłodząca z samoprzylepnym mat Twardość: 65/20 Brzeg 00
Słowa kluczowe: Silikonowa podkładka chłodząca Przewodność cieplna: 6,5 W/mk
Kolor: Ciemnoszary Ciągła temp. użytkowania: -40 do 200 ℃
Próbka: Próbka wolna Grubość: 0,010 cala (0,25 mm) ~ 0,200 cala (5,0 mm)
Aplikacja: komputer przenośny
Podkreślić:

RoHS certified thermal pads

,

self-adhesive silicone cooling pad

,

6.5W/M.K PC laptop thermal pad

RoHS Certified 6.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

 

The TIF®500-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications

 

> Power Electronics
> Automotive Electronics
> Consumer Electronics
> Industrial Control
> New Energy

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®500-65-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 6.5 ASTM D5470
6.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

RoHS Certified 6.5W/m-K Self-Adhesive Thermal Pad Silicone Cooling Pad for PC Laptop 1

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: +86 18153789196

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