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Szczegóły Produktu:
Zapłata:
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| Nazwa produktów: | Łatwa i bezpieczna w montażu podkładka termiczna 7,5 W/MK Silikonowa podkładka chłodząca z samoprzyl | Twardość: | 50/27 Brzeg 00 |
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| Aplikacja: | komputer przenośny | Przewodność cieplna: | 7.5W/m-K |
| Kolor: | Ciemnoszary | Ciągła temp. użytkowania: | -40 do 200 ℃ |
| Próbka: | Próbka wolna | Grubość: | 0,020 cala (0,50 mm) ~ 0,200 cala (5,0 mm) |
| Słowa kluczowe: | Silikonowa podkładka chłodząca | ||
| Podkreślić: | self-adhesive silicone thermal pad,7.5W/M.K laptop cooling pad,PC thermal gap filler |
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Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
The TIF®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features
> High thermal conductivity
> Super soft and highly compliant
> Good insulation performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Industrial Control
> New Energy
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Al Servers
> Semiconductor Packaging
> Low-altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®500-75-11U Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.45 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.020~0.030 | 0.040~0.200 | ASTM D374 |
| (0.50~0.75) | (1.00~5.00) | ||
| Hardness | 50 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant | 8.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 7.5 | ASTM D5470 | |
| 7.5 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Osoba kontaktowa: Dana Dai
Tel: +86 18153789196
