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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Orzecznictwo
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Duży Obraz :  Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF100-60-11U
Dokument: TIF100-60-11U_Data Sheet.pdf
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni pracy
Zasady płatności: T/T
Możliwość Supply: 10000/dzień

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Opis
Nazwa produktów: Wypełniacz szczeliny termicznej Silikonowa podkładka termiczna z przewodnością cieplną 6,0 W/mK do p Przewodność cieplna i kompostion: 6,0 W/mK
Środek ciężkości: 3,4 g/cm3 Budowa: Elastomer silikonowy z wypełnieniem ceramicznym
Kolor: Ciemnoszary Kontynuuj użycie Temp: -40 do 200 ℃
Twardość: 65/27 Brzeg 00 Słowa kluczowe: silikonowa podkładka termiczna
Aplikacja: Do przenoszenia ciepła w elektronice samochodowej

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics


Products description


The TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:


> Good thermal conductive: 6.0 W/mK

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Memory Modules 
>  Mass storage devices 
>  Automotive electronics 
>  Set top boxes 
>  Audio and video components 

 
Typical Properties of TIF®100-60-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007
 
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics 0

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

 

Company Profile

 

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

 

Certifications:


 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  


Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: +86 18153789196

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