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Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Orzecznictwo
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Opinie klientów
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications
Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Duży Obraz :  Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF100L 4035-06
Dokument: TIF100L 4035-06_Data Sheet.pdf
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni pracy
Zasady płatności: T/T
Możliwość Supply: 10000/dzień

Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Opis
Nazwa produktów: Podkładka silikonowa do wypełniania szczelin termicznych o niskiej lotności o wysokiej przewodności Środek ciężkości: 3,1 g/cm3
Przewodność cieplna i kompostion: 4,0 W/m-K Kontynuuj użycie Temp: -40 do 200 ℃
Twardość: 65/35 Brzeg 00 Budowa: Elastomer silikonowy z wypełnieniem ceramicznym
Kolor: biały Słowa kluczowe: Podkładka silikonowa do wypełniania szczelin termicznych
Aplikacja: Do przenoszenia ciepła w zastosowaniach motoryzacyjnych i elektronicznych

Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications


Products description


The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity,
it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneven interfaces effectivelyprotecting delicate electronic components from mechanical stress damage. This series is an ideal thermal interface material of choice for fields sensitive to volatile substances,such as aerospace,automotive electronics, optical devices, and high-end communication equipment.


Features:


> High thermal conductivity
> Low volatility
> High reliability
> Easy to install and operate


Applications:


> Automotive Electronics
> Aerospace
> Optical display
> High-end communication
> Industrial Electronics

 
Typical Properties of TIF®100L 4035-06 Series
Property Value Test method
Color white Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.3 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
4.0 W/m-K ISO22007
 

Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications 0

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for 20 years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

 

Certifications:


 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: +86 18153789196

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