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Szczegóły Produktu:
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| Nazwa produktów: | Wysoka przewodność cieplna 16 W/mK Podkładka termoprzewodząca Materiał silikonowy do radiatora proce | Aplikacja: | Radiator procesora GPU, serwery AI, aplikacje do chłodzenia |
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| Grubość: | 0,75 ~ 5,0 mm | Twardość: | 45 brzeg 00 |
| Stała dielektryczna @1MHz: | 7,0 | Ocena ogniowa: | 94-V0 |
| Słowa kluczowe: | Podkładka termiczna | Przewodność cieplna: | 16,0 W/mK |
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
Products description
The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.
Features:
> Excellent thermal conductivity: 16.0W/mK
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance
Applications:
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®800TS Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.030 | 0.040~0.200 | ASTM D374 |
| 0.75 | (1.00~5.00) | ||
| Hardness (Shore 00) | 45 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 16.0W/m-K | ISO22007 | |
Products specification
Standard Thickness: 0.030" (0.75 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm ×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Osoba kontaktowa: Dana Dai
Tel: +86 18153789196
Polish
