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Szczegóły Produktu:
Zapłata:
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| Nazwa produktów: | Dwuskładnikowy klej silikonowy do zalewania o wysokiej przewodności cieplnej do rozpraszania ciepła | Aplikacja: | Rozpraszanie ciepła w przemyśle elektronicznym |
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| Przewodność cieplna: | 2,8 W/(m·K) | Gęstość (g/cm³): | 2,95 |
| Temperatura pracy: | -45 ~ 200 ℃ | Twardość (Shore A): | 25 |
| Wygląd: | szary | Słowa kluczowe: | Związek do gotowania |
TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.
Feature
> Good thermal conductivity: 2.8W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
| Typical Properties of TIG®680-28AB Series | |||
| Material Properties (Before Curing) | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Gray | Visual | |
| Part A Viscosity (mPa.s) | 7000 | GB/T 10247 | |
| Part B Viscosity (mPa.s) | 8000 | GB/T 10247 | |
| Mix Ratio | 1:1 | Ziitek Test Method | |
| Shelf life | 6 months(Unopened) | Ziitek Test Method | |
| Cure Schedule | |||
| Pot Life @25℃ | 30~45 mins | Ziitek Test Method | |
| Cure @70℃ | 20~30 mins | Ziitek Test Method | |
| Cure Material Properties | |||
| Color | Gray | Visual | |
| Hardness (Shore A) | 25 | ASTM D2240 | |
| Density (g/cm³) | 2.95 | ASTM D792 | |
| Recommended Operating temperature (℃) | -45 ~200 | ***** | |
| Flame Rating | V-0 | UL 94 | |
| Thermal Conductivity (W/mK) | 2.8 | ASTM D5470 | |
| Breakdown Voltage (V/mm) | ≥8000 | ASTM D149 | |
| Dielectric Constant @1MHz | 6.0~8.0 | ASTM D150 | |
| Volume Resistivity (Ohm·cm) | 1.0x1013 | ASTM D257 | |
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Osoba kontaktowa: Dana Dai
Tel: 18153789196
