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Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

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Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty

Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Duży Obraz : Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Szczegóły Produktu:

Place of Origin:	China
Nazwa handlowa:	ZIITEK
Orzecznictwo:	UL and RoHs
Model Number:	TIF100-65-11ES

Zapłata:

Minimum Order Quantity:	1000pcs
Cena:	Negocjowalne
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 days
Supply Ability:	100000pcs/day

Kontakt

Szczegółowy opis produktu

Features:	High compliance adapts to various pressure application environments	Product name:	Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
Keywords:	Silicone Thermal Pad	Thermal conductivity:	6.5W/m-K
Thickness:	0.020~0.20inch(0.50~5.0mmT)	Hardness:	12 Shore 00
Fire rating:	94-V0	Application:	For Advanced Cooling Needs

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Products Discription

TIF^®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of theheat-generating electroniccomponents.

Features

> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

Typical Properties of TIF^®100-65-11ES Series
Color	Gray	Visual
Construction &Compostion	Ceramic filled silicone elastomer	******
Thickness	0.020~0.20inch(0.50~5.0mmT)	ASTM D374
Specific Gravity	3.4g/cc	ASTM D792
Hardness	12 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃	******
Dielectric Breakdown Voltage	≥5500 VAC	ASTM D149
Dielectric Constant	7.0 MHz	ASTM D150
Volume Resistivity	≥1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94-V0	UL E331100
Thermal conductivity	6.5W/m-K	ASTM D5470

Product Specification
Standard Thickness: 0.02"(0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16"X16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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