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Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers

Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Chiny Dongguan Ziitek Electronic Materials & Technology Ltd. Certyfikaty
Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!

—— Peter Goolsby

Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do ​​przemiany fazowej

—— Antonello Sau

Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!

—— Chris Rogers

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Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers

Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers
Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers

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Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: ZIITEK
Orzecznictwo: UL and RoHs
Numer modelu: TIF700PUS
Zapłata:
Minimalne zamówienie: 1000szt
Cena: Negocjowalne
Szczegóły pakowania: 1000pcs/torba
Czas dostawy: 3-5 dni roboczych
Możliwość Supply: 100000pcs/dzień
Szczegółowy opis produktu
Nazwa produktów: Dobre odprowadzanie ciepła Silikonowa podkładka termiczna o mocy 7,5 W do serwerów AI z procesorami Aplikacja: Procesory AI Serwery AI
Kolor: Szary Twardość: 20 Brzeg 00
Słowa kluczowe: silikonowa podkładka termiczna Gęstość (g/m3): 3.2
Zalecana temperatura robocza (°C): -40 do 200 ℃ Napięcie przebicia dielektryka (V/mm): ≥5500
Przewodność cieplna: 7.5W/m-K

Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers

 
The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity:7.5 W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
 
Typical Properties of TIF®700PUS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
0.50~0.75 1.0~5.0
Hardness 70 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity >3.5 X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007
 
Product Specifications

Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (406mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 
Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers 0

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Company profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Szczegóły kontaktu
Dongguan Ziitek Electronic Materials & Technology Ltd.

Osoba kontaktowa: Dana Dai

Tel: 18153789196

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