Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!
—— Peter Goolsby
Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej
—— Antonello Sau
Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors The TIF®500-75-11US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Czytaj więcej
Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... Czytaj więcej
High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek ... Czytaj więcej
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision ... Czytaj więcej
Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Czytaj więcej
High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Company Profile Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences ... Czytaj więcej
3.0W Silicone Thermal Gap Pad For Network Communication Products TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced ... Czytaj więcej
Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely ... Czytaj więcej
Good Insulation Performance 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling The TIF®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision ... Czytaj więcej
High-Performance 8.0W Thermal Gap Filler Pad For Lndustrial Equipment TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid ... Czytaj więcej