Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!
—— Peter Goolsby
Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej
—— Antonello Sau
Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!
Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... Czytaj więcej
High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek ... Czytaj więcej
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate ... Czytaj więcej
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision ... Czytaj więcej
Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech ... Czytaj więcej
Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Czytaj więcej
High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Company Profile Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences ... Czytaj więcej
3.0W Silicone Thermal Gap Pad For Network Communication Products TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced ... Czytaj więcej
Ultra Soft Thermal Pad 3.0W High-Performance Silicone Gap Pads For Electronic Components TIF®500-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environment... Czytaj więcej
Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely ... Czytaj więcej