Thermal Conductive Pad wygląda i działa bardzo dobrze. Teraz nie potrzebujemy już innego termoprzewodzącego podkładu!
—— Peter Goolsby
Współpracowałem z Ziitek przez 2 lata, dostarczali wysokiej jakości materiały termoprzewodzące, a dostawa na czas, polecam ich materiały do przemiany fazowej
—— Antonello Sau
Dobra jakość, dobra obsługa. Twój zespół zawsze udziela nam pomocy i rozwiązania, mamy nadzieję, że będziemy dobrym partnerem przez cały czas!
Ultra Soft 1.5 W/m-K Thermal Silicone Pad Ceramic Filled Silicone Elastomer CPU Heatsink Gap Filler TIF® 100-07S is a silicone-based, thermally conductive gap pad featuring an unreinforced construction for ... Czytaj więcej
Blue 5.0 W/mK Ultra Soft Thermal Gap Filler With Adhesive Coating Silicone Rubber Sheet For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, ... Czytaj więcej
Thermal Gap Filler 3.0W/MK Blue Ultra Soft Natually Tacky Silicone Gap Pad -50 To 200℃ For Medical Equipment Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and ... Czytaj więcej
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics Company Profile Dongguan Ziitek Electronic Material and Technology Ltd., established in 2006, is a high-tech ... Czytaj więcej
Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions Products description The TIF®140-01E is a silicone based, thermally conductive gap pad. ... Czytaj więcej
5G Phone Battery Thermal Conductive Silicone Pad , 0.5-5.0mm Thermal Conductive Gap Filler TIF®500BS is an ultra-soft thermal interface material designed specifically to protect precision components that are ... Czytaj więcej
Factory Price Hot Selling Thermal Conductive Silicon Pad1.5W 0.5~5.0mm Thick Thermal Gap Filler Pad For Car Battery The TIF®100-02F Series is recommended for applications that require a minimum amount of ... Czytaj więcej
Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies Products description TIF® 100-30-10S Series is a well-balanced,general-purpose ... Czytaj więcej
Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies Products description TIF® 100-30-11US Series is an ultra-soft thermal interface material ... Czytaj więcej
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Products description The TIF® 100-60-11U Series is an ultra-soft thermal interface material ... Czytaj więcej